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VIO-Flux Aluminium Brazing Paste Flux

Chemtools Vio FluxChemtools® VIO-Flux Aluminium Brazing Paste Flux is a high activity paste flux specially formulated for soldering aluminium and aluminium alloys to itself or to other metals.

 

VIO-Flux Silver Brazing Paste Flux

VIO-Flux Silver Brazing Paste FluxChemtools® VIO-Flux Silver Brazing Paste Flux is a high activity paste flux specially formulated for brazing copper and brasses, other copper alloys, steel, nickel silver as well as some ferrous alloys.

VIO-Flux Copper/Brass Brazing Paste Flux

VIO-Flux Copper and Brass Brazing Paste FluxChemtools® VIO Copper and Brass Brazing Flux is a high activity paste flux specially formulated for brazing copper and brasses, other copper alloys, steel, nickel silver as well as some ferrous alloys.

VIO-Flux High Activity Liquid Flux

Chemtools VIO-Flux High Activity Liquid FluxChemtools® VIO-Flux High Activity Liquid Flux is a general purpose liquid flux for soldering most grades of stainless steel, chrome, copper & brass. It features fast fluxing action and is used with all types of soft solders.

VIO-Flux High Activity Paste Gel

Chemtools VIO-Flux High Activity Paste GelChemtools® VIO-Flux High Activity Paste Gel is a lead free general purpose soft soldering paste flux which is for use where a liquid flux is not appropriate. It features fast fluxing action and is for use with all types of soft solders.

Chemtools - Behavior of activators

Behavior of Activators

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Chemtools Soft Soldering Flux (VIO Flux)The role of the activators is primarily disruption and removal of the oxide layer on the metal surface (and also the molten solder), to facilitate direct contact between the molten solder and metal. The reaction product is usually soluble or at least dispersible in the molten vehicle. The activators are usually either acids, or compounds that release acids at elevated temperature.

The general reaction of oxide removal is:

Metal oxide + Acid → Salt + Water

Salts are ionic in nature and can cause problems from metallic leaching or dendrite growth, with possible product failure. In some cases, particularly in high-reliability applications, flux residues must be removed.

The activity of the activator generally increases with temperature, up to a certain value where activity ceases, either due to thermal decomposition or excessive volatilization. However the oxidation rate of the metals also increases with temperature.

At high temperatures, copper oxide reacts e.g. with hydrogen chloride to water-soluble and mechanically weak copper chloride, and with rosin to salts of copper and abietic acid which is soluble in molten rosin.

Some activators may also contain metal ions, capable of exchange reaction with the underlying metal; such fluxes aid soldering by chemically depositing a thin layer of easier solderable metal on the exposed base metal. An example is the group of fluxes containing zinc, tin or cadmium compounds, usually chlorides, sometimes fluorides or fluoroborates.

Common high-activity activators are mineral acids, often together with halides, amines, water and/or alcohols:

Inorganic acids are highly corrosive to metals even at room temperature, which causes issues during storage, handling and applications. As soldering involves high temperatures, compounds that decompose or react with acids as products are frequently used:



Information above from http://en.wikipedia.org/wiki/Flux_(metallurgy) under the Creative Commons Attribution-ShareAlike License

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